SKU: 86107923857
Ships within 48 hours · Estimated delivery Sep 9 - Sep 14
jcprogrammer
YIHUA 862D+ BGA 2 in 1 Rework Station Tool / Cell Phone Desoldering Station
Motorola WX-series:
power on failure and current leakage
Phone book backup
RL-044 BGA Stencil For iPhone Huawei Samsung Xiaomi Android CPU Back Glass Replacement jcprogrammerRELIFE RL 044 Precision BGA Reballing Stencil CPU Chip Integrated Steel Mesh For iPhone 6 15 Pro Max, Huawei, Samsung Xiaomi and Android CPU series (SMC Qualcomm Snapdragon series, MTC Dimensity series, HIC hisilicon Kirin series, EMMC BGA series, ACU Android series). RELIFE RL 044 Integrated Tin Planting Steel Stencil For iPhone Huawei Samsung Xiaomi Android CPU RAM Power IC Chip Soldering Reballing Repair. Option: 1. RELIFE RL 044 iPhone series BGA
US$ 99.00
US$ 20.00
US$ 19.55
